The "ARDAI20" accelerated scaling
The "ARDAI20"
accelerated scaling
Built for scalability
As a 20 MW blueprint, ARDAI20 provides seamless scalability, adapting to growing infrastructure needs with precision-engineered modularity.
With a turnkey deployment timeline of as little as 12 months, businesses can have fully operational capacity faster than ever, ensuring maximum efficiency and future-proof expansion.
Designed for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000 W and above per chip.
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Scalable and sustainable
Pre-configured compute and storage — optimized HPC, AI, and hybrid rack setups, supporting up to 170 kW per rack.
Advanced cooling and heat reuse — DLC and RDHx boost efficiency by 70%, enabling waste heat recovery for district heating and industrial use.
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High-density AI compute
Built for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000W and above per chip. Our direct-to-chip liquid cooling system ensures optimal thermal performance, enabling maximum efficiency, sustained high-power computing, and seamless scalability for AI and HPC workloads.
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Direct-to-Chip Liquid Cooling (DLC)
Superior heat dissipation — faster and more effective than air cooling.
Energy efficient — reduces reliance on fans and air conditioning.
Optimized for high-density racks — enables compact, high-performance server designs.
Rear Door Heat Exchanger (RDHx)
Rear Door Heat Exchangers delivers unprecedented thermal efficiency, and when combined with DLC delivers a comprehensive cooling solution for high-density AI and HPC workloads. This best-in-class combination removes heat directly at the chip and at the rack level, ensuring peak performance, maximum energy savings, and over 200 kW cooling per rack — a level never seen before in data center cooling.
Key value
Energy efficiency and sustainability
Designed for ultra-low PUE, leveraging liquid cooling, and focusing on sustainable through efficiency.
Easy scalability as you grow
Prefabricated, modular design for fast deployment (in months, not years), reliability and advanced physical and cyber security.
Use cases
Al and high-performance computing (HPC)
Our modular data centers are engineered for Al and HPC applications, providing high-density, energy-efficient infrastructure to support advanced computing needs.
Edge computing and loT deployments
Ardent's factory-built modules reduce on-site construction time, making them an ideal solution for edge computing and real-time data processing in industrial environments.
Easy scalability and deployment
Our modular data centers allow quick and efficient scalability, enabling customers to expand their data center capacity in response to evolving business requirements.
Infrastructure to full operation
With the ARDAI20, we don’t just provide the data center infrastructure — we deliver a fully integrated, turn-key solution, including:
Server and network pre-installation — full rack integration, cabling, and system setup before deployment.
Optimized configurations — HPC, and storage pre-configured to your AI workload needs.
Seamless deployment — from power and cooling to networking and compute, everything is ready for immediate operation.
Single-point responsibility — we manage the entire installation, testing, and commissioning process.
From facility to fully operational compute, ARDAI20 is a complete, hassle-free solution.
