Zum Inhalt

The "ARDAI20" accelerated scaling

»

Ardent modular data centers redefine scalability, offering powered land, rapid deployment, cost efficiency, and unmatched flexibility for AI, cloud, and HPC workloads. «

Get started

12 Months

minimum to move-in Ready

20 + MW

per ARDAI20 module

150+ kW

per Rack IT load

Built for scalability

As a 20 MW blueprint, ARDAI20 provides seamless scalability, adapting to growing infrastructure needs with precision-engineered modularity. 
 
With a turnkey deployment timeline of as little as 12 months, businesses can havefully operational capacity faster than ever, ensuring maximum efficiency and future-proof expansion. 
 
Designed for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000 and above per chip. 

ND_MD_OverallDC_Layered (2)
ND_MD_Rackrow_Front(2)

Flexible rack and section configurations

Customize racks and sections to match your compute, storage, or hybrid needs.

Scalable sections — Adapt layout, power, and cooling as demands grow.

Optimized efficiency — Seamless integration for performance and sustainability.

ND_MD_Rackrow_Back(2)

Concurrently

maintainable energy configuration

8 x EPG

emergency power generators

8 x 2.4 MW

transformers

ND_Modular_DC_Stills_04 (1)

Scalable and sustainable

Pre-configured compute and storage — optimized HPC, AI, and hybrid rack setups, supporting up to 170 kW per rack.

Advanced cooling and heat reuseDLC and RDHx boost efficiency by 70%, enabling waste heat recovery for district heating and industrial use.

ND_Modular_DC_Stills_06 (1)

High-density AI compute

Built for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000W and above per chip. Our direct-to-chip liquid cooling system ensures optimal thermal performance, enabling maximum efficiency, sustained high-power computing, and seamless scalability for AI and HPC workloads. 

ND_Modular_DC_Stills_03 (1)

Direct-to-Chip Liquid Cooling (DLC)

Superior heat dissipation — faster and more effective than air cooling. 

Energy efficient — reduces reliance on fans and air conditioning. 

Optimized for high-density racks — enables compact, high-performance server designs. 

ND_Racks-Ardent_site-2
ND_Modular_DC_Stills_04 (1)

Rear Door Heat Exchanger (RDHx)

Rear Door Heat Exchangers delivers unprecedented thermal efficiency, and when combined with DLC delivers comprehensive cooling solution for high-density AI and HPC workloads. This best-in-class combination removes heat directly at the chip and at the rack level, ensuring peak performance, maximum energy savings, and over 200 kW cooling per rack — a level never seen before in data center cooling.  

MDC-1

Infrastructure to full operation

With the ARDAI20, we don’t just provide the data center infrastructure — we deliver a fully integrated, turn-key solution, including: 

Server and network pre-installation — full rack integration, cabling, and system setup before deployment.  

Optimized configurations — HPC, and storage pre-configured to your AI workload needs. 

Seamless deployment — from power and cooling to networking and compute, everything is ready for immediate operation. 

Single-point responsibility — we manage the entire installation, testing, and commissioning process. 

From facility to fully operational computeARDAI20 is a complete, hassle-free solution. 

Build your custom data center in Atlanta.

Ardent's ATL1 offers 180 MW capacity, a $0.08 kWh utility rate and 83 acres for scalable development. Book a call to learn more.

Build your custom data center in Atlanta.

Ardent's ATL1 offers 180 MW capacity, a $0.08 kWh utility rate and 83 acres for scalable development. Book a call to learn more.

Get started